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Supply, Delivery and Installation of Sinter Bonding Capability

Published
Published 13 May 2026
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Overview

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

Key details

Country
Unknown
Status
Contract signed
Category
Goods
Procedure
Open
Published
13 May 2026
Classification (CPV)
Laboratory, optical and precision equipments (excl. glasses)

Award outcome

Awarded value
£819,990
Award date
23 March 2026
Winner
  • Inseto UK Limited

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Notice history

Every published notice in this contracting process, newest first.

  1. Contract

    13 May 2026

  2. Contract

    13 May 2026

  3. Contract

    13 May 2026

  4. Contract

    13 May 2026

  5. Contract

    13 May 2026

  6. Contract

    13 May 2026

  7. Contract

    13 May 2026

  8. Contract

    13 May 2026

  9. Contract

    13 May 2026

  10. Contract

    13 May 2026

  11. Contract

    13 May 2026

  12. Contract

    13 May 2026

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Awarded: Supply, Delivery and Installation of Sinter Bonding Capability — won by Inseto UK Limited — Skim