Contract signedUnited Kingdom
CSP25458 - Compact wafer bonder
- Published
- Published 22 October 2025
Overview
***** THIS IS A CONTRACT DETAILS NOTICE, NOT A CALL FOR COMPETITION ***** This procurement is being concluded following a limited competition procurement exercise. Contract details notice for the supply of Compact Vacuum Hot Flat
Press for Wafer Bonding, Dry & Oil-Free Scroll Pump, Digital temperature controlled recirculating water chiller and delivery to UKRI
Key details
- Country
- United Kingdom
- Status
- Contract signed
- Procedure
- Limited
- Published
- 22 October 2025
Award outcome
- Awarded value
- £37,215
- Award date
- 19 October 2025
- PI-KEM Ltd
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Notice history
Every published notice in this contracting process, newest first.
Contract
22 October 2025
View notice ↗
Contracting authority
UK Research and Innovation
BuyerSwindon, United Kingdom
GB-PPON: PDQJ-7126-JDHG
UK Shared Business Services Ltd
Procuring entitySwindon, United Kingdom
GB-PPON: PMPN-7535-GNTG
Authority website ↗
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