Public sector buyers · AUT
Silicon Austria Labs GmbH
Public sector tenders and awarded contracts from Silicon Austria Labs GmbH, tracked by Skim across every UK and EU procurement portal.
- Live opportunities
- 0
- Awarded contracts
- 17
- Total awarded value
- €37,656,666
- Country
- AUT
Tenders & awards
Wartung - Scanning Electron Microscope
Won by FEI Europe B.V. Branch Austria
Awarded 22 June 2026
Silicon Austria Labs – Chips JU: Total Reflection X-Ray Fluorescence Spectrometer (TXRF)
Won by TELTEC Semiconductor Technic GmbH
Awarded 9 June 2026
Silicon Austria Labs – Chips JU: Wafer Reflow Vacuum oven (manual or semi-automated)
Won by budatec GmbH
Awarded 19 May 2026
Silicon Austria Labs – Photonic debonder (manual/ semi-automated)
Won by PulseForge, Inc.
Awarded 11 May 2026
Silicon Austria Labs – Chips JU: Wafer bumper
Won by Pac Tech – Packaging Technologies GmbH
Awarded 8 May 2026
Silicon Austria Labs – Chips JU: Magnetic thin film sputtering deposition equipment
Won by Canon Europa N.V.
Awarded 8 April 2026
Silicon Austria Labs – Chips JU: Resist processing system
Won by Tokyo Electron Europe LTD
Awarded 17 March 2026
Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)
Won by Evatec Europe GmbH
Awarded 19 December 2025
Silicon Austria Labs – Chips JU: Nitride Cluster Tool
Won by Evatec Europe GmbH
Awarded 17 December 2025
Silicon Austria Labs –Deep Ultraviolet (DUV) Lithography Systems
Won by Canon Europa N.V
Awarded 31 October 2025
Silicon Austria Labs – Personalmanagement Tool
Won by rexx systems GmbH
Awarded 22 October 2025
Silicon Austria Labs – ECD – Electrochemical Deposition
Won by ClassOne Technology GmbH
Awarded 12 June 2025
Managed IT Services
Won by addIT Dienstleistungen GmbH & Co KG
Awarded 29 April 2025
Silicon Austria Labs – DIS-Tool
Won by KLA Corporation
Awarded 23 April 2025
Silicon Austria Labs - Plasma Enhanced Chemical Vapor Deposition
Won by Applied Materials South East Asia Pte Ltd
Awarded 6 March 2025
TCWM - Thermocompression Wafer Molding
Won by APIC YAMADA CORPORATION
Awarded 18 February 2025
VSM - Vibrating Sample Magnetometer
Won by JP Kummer Semiconductor Technology GmbH
Awarded 31 January 2025
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