AwardedAUTGoods
TCWM - Thermocompression Wafer Molding
- Published
- Published 20 August 2024
Overview
Ziel der Ausschreibung war die Anschaffung einer Thermokompressionsformanlage (Thermo-compression molding) für SALs Pilotlinie für Fan-out-Wafer-Level-Packaging (https://projekte.ffg.at/projekt/4798640)
Key details
- Country
- AUT
- Status
- Awarded
- Category
- Goods
- Procedure
- Limited
- SME suitable
- Yes
- Published
- 20 August 2024
Laboratory, optical and precision equipments (excl. glasses)
Award outcome
- Awarded value
- €750,150
- Award date
- 18 February 2025
- Contract period
- 18 February 2025 → 14 January 2026
- APIC YAMADA CORPORATION
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Notice history
Every published notice in this contracting process, newest first.
Contract Award Notice
20 March 2025
Contract Notice
20 August 2024
Contracting authority
Silicon Austria Labs GmbH
Procuring entityGraz, AUT
Authority website ↗Silicon Austria Labs GmbH
Procuring entityGraz, AUT
Authority website ↗
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