AwardedAUTGoods€1,260,320
Silicon Austria Labs – Chips JU: Wafer bumper
- Published
- Published 1 September 2025
Overview
Silicon Austria Labs GmbH procured the supply, installation, and commissioning of an automated wafer soldering bumping tool along with associated training services. The contract, valued at €1,260,320, was awarded to Pac Tech – Packaging Technologies GmbH on 8 May 2026.
Key details
- Country
- AUT
- Status
- Awarded
- Category
- Goods
- Estimated value
- €1,260,320
- Procedure
- Limited
- SME suitable
- Yes
- Published
- 1 September 2025
Laboratory, optical and precision equipments (excl. glasses)
Award outcome
- Awarded value
- €1,260,320
- Award date
- 8 May 2026
- Contract period
- 8 May 2026 → 4 March 2027
- Pac Tech – Packaging Technologies GmbH
Contract ending soon? Skim tracks incumbents and flags recompetes early. Book a demo to set up alerts.
Notice history
Every published notice in this contracting process, newest first.
Contract Award Notice
3 June 2026
Contract Notice
1 September 2025
Contracting authority
Silicon Austria Labs GmbH
Procuring entityGraz, AUT
Authority website ↗
Get the full picture
AI analysis, bid scoring, and expert strategy for this tender
Skim analyses every tender against your company profile and tells you whether to bid, how to win, and who you are up against.
See which competitors are winning the contracts you're chasing.
15-minute call. We'll pull the win data on your real pipeline and show you what Skim does with it.