AwardedGermanyGoods
Clustertool for Ion Beam Etching of 300mm wafers
- Published
- Published 19 February 2026
Overview
Fraunhofer-Gesellschaft procured a clustertool for ion beam etching of 300mm wafers designed for CMOS wafer processing in a cleanroom environment at Fraunhofer IPMS, with requirements for metal contamination control and particle generation compatibility with industry standards. The contract was awarded to Scia Systems GmbH on 2 July 2026 and is now complete.
Key details
- Country
- Germany
- Status
- Awarded
- Category
- Goods
- Procedure
- Limited
- SME suitable
- No
- Published
- 19 February 2026
Miscellaneous general and special-purpose machinery
Award outcome
- Awarded value
- €1
- Award date
- 2 July 2026
- Contract period
- 1 December 2026 → 31 December 2026
- Scia Systems GmbH
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Notice history
Every published notice in this contracting process, newest first.
Contract Award Notice
10 July 2026
Contract Notice
19 February 2026
Contracting authority
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
Procuring entityErlangen, Germany
EU: 10342
Authority website ↗
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