AwardedGermanyGoods€375,000
Wafer Bonder
- Published
- Published 25 November 2024
- Deadline
- Closed 9 January 2025
Overview
Die Friedrich-Schiller-Universität Jena beabsichtigt, für Forschungszwecke einen (1) vielseiti-gen und benutzerfreundlichen Wafer Bonder anzuschaffen, welcher in Kombination mit Io-nenstrahlimplantation (am Standort vorhanden) die Herstellung von einkristallinen Dünn-schichten über Exfoliation auf verschiedenen Zielsubstraten mit höchster Flexibilität hinsichtlich der verwendbaren Materialien und zugänglichen Bonding-Prozesse ermöglicht und die technischen Leistungsparameter aus Anlage 2 mindestens erfüllen muss.
Es stehen insgesamt maximal Mittel in Höhe von 377.300,00 € netto exklusive der Kosten zur Einbringung an die Verwendungsstelle zur Verfügung.
Key details
- Country
- Germany
- Status
- Awarded
- Category
- Goods
- Estimated value
- €375,000
- Procedure
- Open
- SME suitable
- No
- Published
- 25 November 2024
- Deadline
- Closed
Laboratory, optical and precision equipments (excl. glasses)
Award outcome
- Award date
- 30 January 2025
- SUSS MicroTec Solutions GmbH & Co. KG
Contract ending soon? Skim tracks incumbents and flags recompetes early. Book a demo to set up alerts.
Notice history
Every published notice in this contracting process, newest first.
Contract Award Notice
4 February 2025
Contract Notice
25 November 2024
Contracting authority
Friedrich-Schiller-Universität Jena
Procuring entityJena, Germany
Get the full picture
AI analysis, bid scoring, and expert strategy for this tender
Skim analyses every tender against your company profile and tells you whether to bid, how to win, and who you are up against.
See which competitors are winning the contracts you're chasing.
15-minute call. We'll pull the win data on your real pipeline and show you what Skim does with it.