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AwardedGermanyGoods

Deep Reactive Ion Etching (DRIE) Si fluorine chemistry etcher

Published
Published 26 March 2026
Deadline
Closed 28 April 2026

Overview

Helmholtz-Zentrum Dresden-Rossendorf procured a Deep Reactive Ion Etching (DRIE) Si fluorine chemistry etcher from SENTECH Gesellschaft für Sensortechnik mbH, awarded on 9 June 2026. The equipment will provide deep trench etching and through-via capabilities for the IBC cleanroom to support magnetic nanodevice fabrication under the MagKI investment programme, with delivery, installation and site acceptance testing required by 1 June 2027, along with documentation in English and German, a two-year warranty, and operation in ISO Class 6 cleanroom environments.

Key details

Country
Germany
Status
Awarded
Category
Goods
Procedure
Open
SME suitable
No
Published
26 March 2026
Deadline
Closed
Classification (CPV)
Laboratory, optical and precision equipments (excl. glasses)

Award outcome

Awarded value
-€1
Award date
9 June 2026
Contract period
— → 6 December 2026
Winner
  • SENTECH Gesellschaft für Sensortechnik mbH

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Notice history

Every published notice in this contracting process, newest first.

  1. Contract Award Notice

    11 June 2026

  2. Contract Notice

    26 March 2026

Contracting authority

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Awarded: Deep Reactive Ion Etching (DRIE) Si fluorine chemistry etcher — won by SENTECH Gesellschaft für Sensortechnik mbH — Skim