LA3183C - UCC - CFT for the Supply, Delivery, Installation, Commissioning and Calibration of a Non-contact Wafer Sheet Resistance Mapper for Tyndall National Institute, University College Cork (UCC)

University College Cork request the supply of a Non-contact Wafer Sheet Resistance Mapper for use with semiconductor materials in wafer and coupon format. The required system will be used to carry out high precision, quantitative measurements of resistivity on the surface of a wafer following semiconductor wafer processing. The system will be required to measure sheet resistance with high accuracy. Wafer mapping and automated measurements will be required, and the system must be suited for use with wafer sizes of up to 200mm (8-inches) in diameter as well as small pieces of 10mm square.